Non-flow, room-temperature cure tan epoxy adhesive with a long work life. Its low outgassing properties make it particularly suitable for spacecraft applications. Suitable for bonding metal, wood, glass, ceramics and some plastics. Faster curing than Epibond® 1210 A / 9615 A adhesive.
Unit of Measure
Typical Properties
Appearance |
N/A Semi-Paste |
Original Equipment Manufacturer (OEM) Specifications |
N/A Lockheed Martin LAC 30-4639-0200, REV H/Loral 23-P12027-0003, REV 7 /Spectrolab 044418, REV A1 |
Mix Ratio Ritt by Weight |
N/A 100:20 |
Minimum Gel Time/Pot Life at 77 Fahrenheit (ºF) Temperature |
N/A 35-60 (100 gram mass) minutes |
Suggested Cure Schedule Fahrenheit (ºF) |
N/A 48 hrs at 77 ºF or 1-2 hrs at 150 ºF |
Maximum Service Temperature |
N/A 250 ºF |
Lap Shear Strength at 77 Fahrenheit (ºF) Temperature (Aluminum to Aluminum) |
N/A 2,800 psi |
Lap Shear Strength at 180 Fahrenheit (ºF) Temperature (Aluminum to Aluminum) |
N/A 2,500 psi |
Flame Retardant |
N/A No |
Packaging |
N/A Working packs |
